Overview
The Andromeda XZU65 system-on-chip (SoC) module combines high-end Xilinx’s Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, dual parallel quad SPI flash, dual Gigabit Ethernet PHY, USB 3.0 and thus forms a complete and powerful embedded processing system. This module is suitable for high-speed applications and video applications thanks to the high number of transceivers, to the superior module connector performance and to the large bandwidth of the DDR channels.
Highlights
- Built around Xilinx’s Zynq Ultrascale+™ MPSoC
- Two independent memory channels for PS (DDR4 ECC SDRAM) and PL (DDR4 SDRAM)
- 32.4 GByte/sec memory bandwidth
- Offers up to PCIe® Gen3 x16, PCIe Gen2 x4, USB 3.0 and 2 x Gigabit Ethernet interfaces
- Available in industrial temperature range
- Three ADM6-60 Samtec connectors with a total of 322 user I/Os
- Linux BSP and tool chain available
- Powerful and compact FPGA board
Benefits
- A complete and powerful embedded processing system in a compact, space-saving form factor
- Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM (PS) and up to 8 GByte of DDR4 RAM (PL)
- High-bandwidth data transfer: PCIe® Gen3 x16, PCIe Gen2 x4, USB 3.0 at low integration cost
- High number of transceivers available for various communication protocols
- High number of user I/Os and FPGA logic resources for powerful applications
- Support for Linux operating system
Features
- Xilinx® Zynq Ultrascale+™ MPSoC
- ARM® quad-core Cortex™-A53
- ARM dual-core Cortex™-R5
- Mali-400MP2 GPU
- H.264 / H.265 Video Codec (only for EV models)
- 16nm FinFET+ FPGA fabric
- Up to 8 GB DDR4 ECC SDRAM (PS)
- Up to 8 GB DDR4 SDRAM (PL)
- 128 MB QSPI flash dual parallel
- 16 GB eMMC flash
- PCIe® Gen3 ×16 and PCIe Gen2 ×4
- 24 × 6/16.3 Gbit/sec MGT
- 4 GTR
- 20 GTH
- 2 × Gigabit Ethernet (PS and PL)
- USB 2.0/3.0 (host/device)
- Up to 653,100 LUT4-eq
- 322 user I/Os
- 22 ARM peripherals
- 180 FPGA I/Os (24 HD + 156 HP)
- 120 MGT signals (clock and data)
- 12 V single supply
- Small form factor (68 × 52 mm)
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
| Product Code | MPSoc | DDR4 ECC SDRAM (PS) | DDR4 SDRAM (PL) | Temp. Range | Status |
|---|---|---|---|---|---|
| AM-XZU65-7EV-2I-D3E | XCZU7EV-2FFVC1156I | 4GB | 4GB | -40 to +85C |
|
| AM-XZU65-11EG-2I-D3E | XCZU11EG-2FFVC1156I | 4GB | 4GB | -40 to +85C |
|
| Custom Models | TBC | TBC | TBC | TBC |
|
Key: 
Mass Production 
Sampling 
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
Operating System Support
OS | Details | Availability | Partner |
|---|---|---|---|
 Linux | BSP support for: DDR4 SDRAM eMMC flash Quad SPI flash USB host Gigabit Ethernet U-boot bootloader Comprehensive user documentation Software development how-to guide. | Available Now |  |
Target Applications
- High-Speed Communications
- Image Processing
- Digital Signal Processing
- Data Acquisition
- Drive/Motion Control
- Embedded Computing
Information on the product may change, please check the manufacturers website and page for the most up to date information, see the link at the top right of this page.
