Xilinx® Zynq® UltraScale+ MPSoC Module

Overview

The Andromeda XZU90 system-on-chip (SoC) module combines high-end Xilinx’s Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, dual parallel quad SPI flash, dual Gigabit Ethernet PHY, USB 3.0 and thus forms a complete and powerful embedded processing system. This module is suitable for high-speed applications due to the high number of transceivers and due to the superior module connector performance.

Highlights

  • Built around Xilinx’s Zynq Ultrascale+™ MPSoC
  • DDR4 SDRAM with Error Correction Code (ECC)
  • 19.2 GByte/sec memory bandwidth
  • Offers up to 5 x PCIe® Gen3 x16, PCIe Gen2 x4, USB 3.0 and 2 x Gigabit Ethernet interfaces
  • Available in industrial temperature range
  • Six ADM6-60 Samtec connectors with a total of 686 user I/Os
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board

Benefits

  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
  • High-bandwidth data transfer: up to 5 x PCIe® Gen3 x16, PCIe Gen2 x4, USB 3.0 at low integration cost
  • High number of transceivers available for various communication protocols
  • High number of user I/Os and FPGA logic resources for powerful applications
  • Support for Linux operating system

Features

  • Xilinx® Zynq Ultrascale+™ MPSoC
    • ARM® quad-core Cortex™-A53
    • ARM dual-core Cortex™-R5
    • Mali-400MP2 GPU
    • 16nm FinFET+ FPGA fabric
  • Up to 8 GB DDR4 ECC SDRAM (PS)
  • 128 MB QSPI flash dual parallel
  • 16 GB eMMC flash
  • Up to 5 x PCIe® Gen3 ×16 and PCIe Gen2 ×4
  • 76 × 6/16.3/25 Gbit/sec MGT
    • 4 GTR
    • 44 GTH
    • 28 GTY
  • 2 × Gigabit Ethernet (PS and PL)
  • USB 2.0/3.0 (host/device)
  • Up to 1,143,000 LUT4-eq
  • 686 user I/Os
    • 22 ARM peripherals
    • 284 FPGA I/Os (24 HD + 260 HP)
    • 380 MGT signals (clock and data)
  • 12 V single supply
  • Small form factor (80 × 64 mm)

Module Architecture

Click image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product Code

MPSoc

DDR4 ECC SDRAM (PS)

Temp. Range

Status

AM-XZU90-17EG-1E-D12E

XCZU17EG-1FFVD1760E

4GB

0 to +85C

AM-XZU90-19EG-2I-D13E

XCZU19EG-2FFVD1760I

8GB

-40 to +85C

Custom Configurations

TBC

TBC

TBC

Key: Mass Production Sampling Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Operating System Support

The OS support is in development

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing

Information on the product may change, please check the manufacturers website and page for the most up to date information, see the link at the top right of this page.