Xilinx® Spartan®-6 LX FPGA Module

Xilinx® Spartan®-6 LX FPGA Module
Xilinx® Spartan®-6 LX FPGA Module
Xilinx® Spartan®-6 LX FPGA Module

MATURE PRODUCT

This is a mature product: do not use for new designs. The product remains in mass production until further notice. Please contact us for more information.

Upgrade to Xilinx Artix-7

If you need a more powerful FPGA module or want to upgrade your current Xilinx Spartan-6 solution, then have a look at the Mars AX3.

Overview

The Mars MX1 FPGA module is equipped with fully EtherCAT-compliant dual Fast Ethernet PHYs and fast DDR2 SDRAM. It is thus perfectly suited for compact SoPC systems based on the Xilinx Microblaze soft processor communicating via real-time field buses.

The SO-DIMM form factor allows space-saving hardware designs, and quick and simple integration of the FPGA board into the target application.

Highlights

  • Low-cost, low-power FPGA
  • Uses the widely-supported and compact SO-DIMM form factor
  • Available with different FPGA densities
  • Available in industrial temperature range
  • Dual Fast Ethernet for Industrial Ethernet like PROFINET, EtherCAT, POWERLINK or Ethernet/IP
  • Powerful and compact FPGA board

Benefits

  • Simple, low-cost and rugged assembly, in the industry-standard SO-DIMM form factor
  • Fast boot times and support for execution-in-place (XiP) due to the 4 bit parallel SPI Flash
  • Lowest power consumption due to the high-efficiency DC/DC converters and support for SUSPEND.
  • Many IP cores are available from Xilinx, Enclustra and 3rd parties.

Features

  • Xilinx Spartan-6 LX FPGA
  • SO-DIMM form factor (67.6 x 30 mm, 200 pins)
  • 108 user I/Os, single-ended or differential
  • 16 MB quad SPI Flash
  • Up to 256 MB DDR2 SDRAM
  • Dual Fast Ethernet PHYs (fully EtherCAT-compliant)
  • Real Time Clock (± 5 ppm, with temperature sensor)
  • Single 3.3V supply voltage

Module Architecture

Xilinx® Spartan®-6 LX FPGA Module

Click image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeFPGAQuad SPI FlashDDR2 SDRAMEthernet PHYReal Time ClockTemp RangeStatus
MA-MX1-45-3C-D7XC6SLX45-3CSG324C16MB128MBDual 100MbpsYes0 to +70C

Key: Mass Production Sampling Contact us

Mars Heatsink

The Mars heat sink is an optimal solution to cool the Mars MX1 – it’s low profile (less than 7 mm tall) and covers the whole module surface. It comes with a gap pad for the FPGA and four screws to attach it to the module PCB. With additional user configured gap pads, it is possible to cool other components on board as well.

To cool the module even further, a mounting slot in the center of the heat sink makes it easy to attach fans of different sizes – see the technical drawing for details.

Base Boards

Base Board

Description

Mars ST3

An ideal platform for display applications

Mars EB1

An ideal platform for a stereo frame grabber and other video applications.

Mars PM3

A powerful platform with a wealth of I/O interfaces: Ethernet, USB 3.0, FMC low pin count and more.

Target Applications

  • Data Acquisition
  • High-Speed Communications
  • Digital Signal Processing
  • Image Processing
  • Embedded Computing

Information on the product may change, please check the manufacturers website and page for the most up to date information, see the link at the top right of this page.