Xilinx® Zynq® UltraScale+ MPSoC Module

Xilinx® Zynq® UltraScale+ MPSoC Module
Xilinx® Zynq® UltraScale+ MPSoC Module
Xilinx® Zynq® UltraScale+ MPSoC Module

Overview

The Mercury+ XU1 system-on-chip (SoC) module combines Xilinx’s Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.

Highlights

  • Built around Xilinx’s Zynq Ultrascale+™ MPSoC
  • DDR4 SDRAM with Error Correction Code (ECC)
  • 19.2 GByte/sec memory bandwidth
  • Offers PCIe® Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
  • Available in industrial temperature range
  • Three 168-pin Hirose FX10 connectors with 294 user I/Os
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board

Benefits

  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
  • High-bandwidth data transfer; PCIe® Gen2 x4 interface, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux operating system

Features

  • Xilinx® Zynq Ultrascale+™ MPSoC
    • ARM® dual-/quad-core Cortex™-A53
      (64 bit, up to 1500 MHz)
    • ARM dual-core Cortex™-R5
      (32 bit, up to 600 MHz)
    • Mali-400MP2 GPU
    • 16nm FinFET+ FPGA fabric
  • Up to 8 GB DDR4 ECC SDRAM
  • 64 MB QSPI flash
  • 16 GB eMMC flash
  • PCIe® Gen2 ×4
  • Up to 20 × 6/12.5/15 Gbit/sec MGT
  • 2 × Gigabit Ethernet
  • 2 × USB 3.0
  • 2 × USB 2.0 (host & host/device)
  • Up to 747,000 LUT4-eq
  • 294 user I/Os
    • 14 ARM peripherals
    • Up to 200 FPGA I/Os
    • Up to 100 MGT signals (clock and data)
  • 5 to 15 V single supply
  • Small form factor (74 × 54 mm)

Module Architecture

Xilinx® Zynq® UltraScale+ MPSoC Module

Click image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product Code

MPSoC

DDR4 SDRAM

DDR4 ECC

GTH MGTs

Temp. Range

Status

ME-XU1-6CG-1E-D11E-G1

XCZU6CG-
1FFVC900E

2GB

Yes

16

0 to +85C

ME-XU1-6CG-1E-D11E

XCZU6CG-
1FFVC900E

2GB

Yes

12

0 to +85C

ME-XU1-6EG-1I-D11E-G1

XCZU6EG-
1FFVC900I

2GB

Yes

16

-40 to +85C

ME-XU1-6EG-1I-D11E

XCZU6EG-
1FFVC900I

2GB

Yes

12

-40 to +85C

ME-XU1-9EG-1E-D11E-G1

XCZU9EG-
1FFVC900E

2GB

Yes

16

0 to +85C

ME-XU1-9EG-2I-D12E

XCZU9EG-
2FFVC900I

4GB

Yes

12

-40 to +85C

ME-XU1-9EG-2I-D12E-G1

XCZU9EG-
2FFVC900I

4GB

Yes

16

-40 to +85C

ME-XU1-9EG-3E-D12E

XCZU9EG-
3FFVC900E

4GB

Yes

12

-40 to +85C

ME-XU1-15EG-1E-D12E-G1

XCZU15EG-
1FFVC900E

4GB

Yes

16

0 to +85C

ME-XU1-15EG-2I-D12E

XCZU15EG-
2FFVC900I

4GB

Yes

12

-40 to +85C

ME-XU1-15EG-2I-D12E-G1

XCZU15EG-
2FFVC900I

4GB

Yes

16

-40 to +85C

Key: Mass Production Sampling Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base board

Description

Mercury+ PE1

A feature packed board with 3 different variants compatible with all Mercury and Mercury+ modules.

Mercury+ ST1

A flexible board optimised for video applications and the perfect fit for our Mercury and Mercury+ modules.

Operating System Support

Select one of these base boards to get started with development straight out of the box.

OS

Details

Availability

Partner

Linux

BSP support for:
DDR4 SDRAM
eMMC flash
Quad SPI flash
USB host
Gigabit Ethernet
U-boot bootloader
Comprehensive user documentation
Software development how-to guide.

Available Now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing

Information on the product may change, please check the manufacturers website and page for the most up to date information, see the link at the top right of this page.