High speed optical communication using SAMTEC FireFly optical connector on FMC/FMC+ module
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SAMTEC FireFly ™ TECHNOLOGY
Techway has selected Samtec’s FireFly™ technology as optical backplane and front end solutions for high density and high bandwidth interfaces compliant with the VITA 57.1 standard (FPGA Mezzanine Card).
TechwaY’s TigerFMC features 10 full duplex links at a rate of up to 10 Gigabits per second for an aggregate bit rate of 200 Gbps. This 200 Gbps aggregate bandwidth outperforms all existing communication solutions. TigerFMC is available in both rugged and commercial versions. This high density optical FMC can be installed on legacy hardware, either to create high density signals on the front-end or to expand existing VPX configurations with a VITA 66 fiber-optic backplane.
The computing market is driven by a growing demand for processing capabilities which require ever-increasing communication bandwidth. Optical High-Speed Serial links (HSS) are the perfect solution to this need. Communication protocols are evolving to take advantage of the high bandwidth capabilities of these new HSS links. The market is also looking for simplicity of connectivity, even for optics.
The TigerFMC allows system integrators to easily integrate new broadband protocols on their legacy hardware (Gigabit Ethernet, sFPDP, Fiber Channel, Aurora, ARINC818).
Samtec’s FireFly™ micro flyover cable system enables TechwaY’s TigerFMC to meet these requirements by offering up to 10 full duplex high-speed serial links at 10 Gbps each, and intelligent connectivity ready for front-end and backplane implementation. The FireFly™ x12 unidirectional or bidirectional optical transceiver assembly, with proven 850 nm VCSEL array technology, achieves 14 Gbps per channel, with 28 Gbps (336 Gbps aggregate) and x4 bidirectional systems in development. FireFly™ allows an easy upgrade from copper to optical with the same connector and footprint.
“TechwaY is taking full advantage of FireFly’s physical design and performance characteristics,” said Adam Linderman, SI Product Manager for Samtec. “With FireFly™, Samtec has addressed many of the considerations that must be taken into account when designing a system utilizing mid-board optics: density, board layout, power consumption, and thermals. FireFly™ addresses these concerns with an integral heat sink for thermal considerations, high speed signal and control signals segregated in the engine, and a user-friendly edge card mating design. These core characteristics allow FireFly™ to be the most dense 14G solution in the market. The simplification that comes from using FireFly™ truly sets the solution apart in the mid-board market. This is being confirmed with the growing number of adoptions we are seeing in both the high performance computing and FMC markets today.”
The TigerFMC is 100% compliant with VITA 57. More details…
Samtec, Inc., is an international supplier of interconnects, cable assemblies, and design solutions. Products include high speed board level interconnects, high speed cable assemblies, optical systems, IC packaging and microelectronics expertise, among others. Samtec provides full channel system support, streamlining and optimizing the signal path, from the IC to the board and beyond. Samtec’s approximately 4,000 worldwide associates are located at four primary manufacturing centers, six support offices, and sales and support offices on every continent.
More information about SAMTEC: www.samtec.com or www.samtec.com/firefly
